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A unique blend of unmatched Signal Integrity and IC Packaging expertise positions Samtec to provide full channel system support, effectively streamlining, and thereby optimizing, the signal path - from the IC to the board and beyond.
Contact our application engineering experts. We’ll connect you with a product specialist who can help you find the answers to your specific application questions.
Call Us: +1-844-558-3291
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Call Us: +1-800-726-8329 or +1-812-944-6733
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Listed below is the processing literature we have available. Click on the links below to view an online version or right click to download.
If you do not find the information that you are looking for below or require more information, scroll down to get support from our Interconnect Processing Group.
Samtec’s surface mount components are rated MSL level 1 and are compliant with the lead free reflow profile parameters detailed in
Our Interconnect Processing Group is an in-house staff of engineers to support your interconnect processing concerns. IPG can assist you to improve the overall processing and manufacturability of your board as well as help lower its total applied cost.
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For more information, please check our
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