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Broadcast Video 3G SDI Industry Standard

Broadcast Video - 3G SDI

true 75 Samtec's signal integrity expertise and high speed interconnect solutions are ideal for many of the physical and electrical routing challenges facing the broadcast video industry. With the advent of 3 Gbps Serial Digital Interface (3G SDI) enabling uncompressed digital transfer of 1080p and digital cinema, signal integrity design expertise is more important than ever to ensure the required bandwidth is available in the finished product.

True75 75Ω RF Systems

Connectors are certified 75Ω +/- 3Ω for straight and +/- 4Ω for right angle and are ideal for 3 Gbps. The Samtec RF systems listed below help ensure that your design will meet and/or surpass 3G SDI requirements.

modified bnc
Product Orientations Samtec Part Number
75Ω BNC Jack Vertical Edge Mount Right Angle BNC7T
75Ω SMB Jack Vertical Edge Mount Right Angle SMB7H
75Ω MCX Jack Vertical Edge Mount Right Angle MCX7

Board-to-Board Solutions for 3G SDI

Samtec board-to-board interconnects meet or exceed requirements for 3G SDI rear panel I/O card interfaces. These connectors are available in coplanar, right angle, and vertical orientations for maximum design and routing flexibility.

mod
Product Perpendicular Coplanar
High Speed Edge Card with Edge Rate® Contacts HSEC8-DV to Card Edge HSEC8-EM to Card Edge
SEARAY High Density Arrays
SEAM to SEAF-RA SEAM-RA to SEAF-RA
SEAM-RA to SEAF
Q Strip® Ground Plane Connectors
QMS-RA to QFS QMS-RA to QFS-RA
QMS to QFS-RA
QMS-EM to QFS QMS-EM to QFS-EM
QMS to QFS-EM
Rugged High Speed Edge Rate® Strips
ERM8-RA to ERF8 ERM8-RA to ERF8-RA
ERM8 to ERF8-RA
ERM8-EMX to ERF8 ERM8-EMXto ERF8-EMX
ERM8 to ERF8-EMX

Full Turnkey Modules

kit

Samtec also designs full passive I/O modules. Modules include I/O connectors, board/trace layout for optimum 75Ω performance, and passive to active board connector solutions. Our experience and signal integrity expertise ensures accuracy on the first design, saving you time, design resources, and design iterations.
Contact 3GSDI@samtec.comfor more information.


3G SDI Test Kits

Samtec, in conjunction with Brioconcept and Gennum has developed a customized Final Inch® evaluation kit for 75Ω 3G protocol. The kit is exceptionally accurate at measuring 3G SDI signal quality in the connector breakout regions. It simulates the entire transmission line paths from BNCs through high speed interconnect (the Samtec HSEC8 Series) and the equalizers and cable drivers on the active board.

The evaluation kit utilizes high quality Samtec SMA Connectors to launch signals to/from the system for performance measurement. The True75 BNC is also integrated into the passive interface cards with all three typical orientations represented:

Contact finalinch@samtec.com for more information.

Additional Information: Broadcast Video Solutions Brochure

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